About this part
Description
- Tin mesh designed for accurate reballing of iPhone 14 Pro and 14 Pro Max logic board solder pads
- Ensures precise restoration of pad structures during middle-layer and IC rework
- Improves alignment and consistency for CPU, PMIC and multilayer module repairs
- High-temperature resistant mesh suitable for professional microsoldering work
- Optimized for restoring missing or damaged solder points across internal board layers
- YCS mesh engineered for stable, reliable performance in advanced board-level repair
Compatible with:
New part. We deliver it across the whole EU: it ships in 1–2 working days. If you haven't installed or used it, you have 14 days to return it; batteries, screens, control boards and displays that have already been connected can't be returned unless defective.