About this part
Description
- Tin mesh designed for precise reballing of iPhone 12 Pro Max logic board solder pads
- Restores damaged or missing pad structures during IC and multilayer board repair
- Ensures accurate alignment and consistent solder distribution across reworked areas
- Ideal for CPU, PMIC and mid-layer module reballing on the iPhone 12 Pro Max
- High-temperature resistant mesh suitable for professional microsoldering workflows
- YCS mesh engineered for reliability and accuracy in board-level rework
Compatible with:
New part. We deliver it across the whole EU: it ships in 1–2 working days. If you haven't installed or used it, you have 14 days to return it; batteries, screens, control boards and displays that have already been connected can't be returned unless defective.