
Amtech NC-559-V2 No-Clean Solder Paste in a 35g syringe for controlled dispensing during BGA/SMD rework and PCB assembly. Melting point: 183 °C (361 °F) .
Key specs: Sn63/Pb37 (leaded) • T3 powder • 25–45 µm • 87% metal content • No-Clean flux • 35g syringe.
Use cases: BGA/SMD rework, stencil and touch-up work, PCB assembly and repair where precise paste placement is required.
Check from the photo and the name that it is the right part for your model before buying it; if you have any doubts, message us on WhatsApp and we'll confirm it for you.
New part. We ship it across the US: it leaves in 1–2 business days. If you haven't installed or used it, you have 14 days to return it; batteries, screens, control boards and displays that have already been connected can't be returned unless defective.
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