YCS Promax Mid-layer General-purpose Tin Planting Platform For iPhone X / 11 Series

$14.92

● In stock · ships in 1–2 working days

🚚 Shipping $5.99 · free from $350.00
↩️ 14 days to return it unused (terms)
🔒 Card payment via Stripe

About this part

Description

Tin mesh designed for precise reballing of iPhone 11 Pro, 11 Pro Max and XS Max logic board solder pads
Restores damaged or missing pad structures during IC replacement and multilayer board repair
Ensures accurate alignment and consistent solder distribution across rebuilt sections
Ideal for CPU, PMIC and mid-layer module reballing on the listed iPhone models
High-temperature resistant mesh suitable for professional microsoldering workflows
YCS mesh engineered for accuracy, durability and stable performance in board-level rework

Compatible with:

iPhone 11 Pro Max

New part. We ship it across the US: it leaves in 1–2 business days. If you haven't installed or used it, you have 14 days to return it; batteries, screens, control boards and displays that have already been connected can't be returned unless defective.