YCS Mid-layer General-purpose Tin Planting Platform For iPhone 17 Series

About this part

Description

• Mid-layer solder mesh designed for accurate reballing of iPhone 17, 17 Pro and 17 Pro Max multilayer boards
• Ensures precise restoration of solder points across middle layers during board-level repair
• Improves alignment and consistency when rebuilding damaged or missing solder pads
• Ideal for CPU, PMIC and multilayer IC repair on iPhone 17 series logic boards
• High-temperature resistant mesh compatible with professional microsoldering workflows
• YCS mesh optimized for reliability and accuracy in advanced logic board rework

Compatible with:

New part. We deliver it across the whole EU: it ships in 1–2 working days. If you haven't installed or used it, you have 14 days to return it; batteries, screens, control boards and displays that have already been connected can't be returned unless defective.