About this part
Description
- Mid-layer solder mesh designed for precise reballing of iPhone 16 Pro and 16 Pro Max multilayer logic boards
- Restores damaged or missing solder points across internal board layers
- Ensures accurate alignment during reconstruction of middle-layer solder pads
- Ideal for repairing CPU, PMIC and complex IC modules in the iPhone 16 Pro series
- High-temperature resistant mesh optimized for professional microsoldering environments
- YCS mesh engineered for consistent accuracy in advanced board-level rework
Compatible with:
New part. We ship it across the US: it leaves in 1–2 business days. If you haven't installed or used it, you have 14 days to return it; batteries, screens, control boards and displays that have already been connected can't be returned unless defective.